By James J. Licari
This e-book is exclusive in its entire insurance of all features of adhesive know-how for microelectronic units and packaging, from concept to bonding to check strategies. as well as common purposes, similar to dies, substrate, and lid and chip stack attachments, the booklet contains new advancements in anisotropic, electrically conductive, and underfill adhesives. fast curing equipment reminiscent of UV, microwave, and moisture (which agree to present environmental and effort requisites) are coated. Over eighty tables and one hundred twenty figures supply a wealth of information on houses, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and kit. every one bankruptcy offers finished references.
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Extra resources for Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
Design Guidelines For Use of Adhesives and Organic Coatings in Hybrid Microcircuits, NASA Technical Memorandum TM X-64908, (Dec. 1974) 42. Marshall Space Flight Center Drawing MSFC 16A02053. 43. Licari, J. , Weigand, B. , and Soykin, C. , Development of a Qualification Standard for Adhesives Used in Hybrid Microcircuits, NASA CR-161978 (Dec. 1981) 44. Kraus, H. , Chip Adhesives Update, Solid State Technol. (Mar. 1987) 45. Ebel, G. , and Englekey, H. A, Polymeric Materials and the New Mil Specs: A Hybrid Users View, Proc.
1988) 38. Pietrucha, B. , and Reiss, E. , The Reliability of Epoxy as a Die Attach in Digital and Linear Integrated Circuits, Proc. , pp. 234–238 (Apr. 1974) 39. Shenfield, D. , Microcircuit Adhesives Tutorial, Hybrid Circuit Technol. (Oct. 1987) 40. Rich, R. , Anaerobic Adhesives, Handbook of Adhesive Technology, (A. Pizzi and K. L. ), Marcel Dekker (1994) 41. Design Guidelines For Use of Adhesives and Organic Coatings in Hybrid Microcircuits, NASA Technical Memorandum TM X-64908, (Dec. 1974) 42.
14] MCMDs may also be multilayered to form up to 8 conductor layers. 19 shows the construction of an MCM-D interconnect substrate consisting of five conductor layers. 19. Cross-section of an MCM-D multilayer construction. MCM-C interconnect substrates are produced from either low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). Either process can produce multilayer substrates having high numbers of conductor layers (up to 100), although for most applications 2 to 20 layers are sufficient.
Adhesives Technology for Electronic Applications: Materials, Processing, Reliability by James J. Licari